NXP USA Inc. MC68L11D0FNE2

MC68L11D0FNE2 NXP USA Inc.
NXP USA Inc.

Product Information

HTSUS:
8542.31.0001
RoHS Status:
ROHS3 Compliant
Program Memory Size:
-
Peripherals:
POR, WDT
Operating Temperature:
0°C ~ 70°C (TA)
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Package / Case:
44-LCC (J-Lead)
RAM Size:
192 x 8
Program Memory Type:
ROMless
REACH Status:
REACH Unaffected
Connectivity:
SCI, SPI
Package:
Tube
EEPROM Size:
-
Oscillator Type:
Internal
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Number of I/O:
26
DigiKey Programmable:
Not Verified
Core Size:
8-Bit
Mounting Type:
Surface Mount
Series:
HC11
Supplier Device Package:
44-PLCC (16.59x16.59)
Data Converters:
-
Core Processor:
HC11
Speed:
2MHz
Base Product Number:
MC68L11
ECCN:
EAR99
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This is manufactured by NXP USA Inc.. The manufacturer part number is MC68L11D0FNE2. It is assigned with possible HTSUS value of 8542.31.0001. The product is rohs3 compliant. It has supplied with other peripherals, such as por, wdt. The product has 0°c ~ 70°c (ta) operating temperature range. The supply voltage of a bespoke product includes 3v ~ 5.5v. Moreover, the product comes in 44-lcc (j-lead). The product has typical 192 x 8 RAM size. It is a romless program memory type. In addition, it is reach unaffected. It provides connectivity solutions through sci, spi. It is shipped in tube package . The product is a internal type of oscillator. Its typical moisture sensitivity level is 3 (168 hours). 26 is the I/O value of the product. It has a core size 8-bit. The product is available in surface mount configuration. The product hc11, is a highly preferred choice for users. 44-plcc (16.59x16.59) is the supplier device package value. hc11 is the product's core processor. It has a robust speed of 2mhz. Moreover, it corresponds to mc68l11, a base product number of the product. The product is designated with the ear99 code number.

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NXP USA Inc REACH(Environmental Information)
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NXP USA Inc RoHS Cert(Environmental Information)
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MC68HC11(711)Dx, MC68L11D0(Datasheets)
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MC68HC11D(Datasheets)
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All Dev Label Update 15/Dec/2020(PCN Packaging)

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FAQs

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