NXP USA Inc. S9S12GN48F0MLFR

S9S12GN48F0MLFR NXP USA Inc.
NXP USA Inc.

Product Information

Detailed Description:
12V1 HCS12 Microcontroller IC 16-Bit 25MHz 48KB (48K x 8) FLASH 48-LQFP (7x7)
Package / Case:
48-LQFP
Peripherals:
LVD, POR, PWM, WDT
Operating Temperature:
-40°C ~ 125°C (TA)
Voltage - Supply (Vcc/Vdd):
3.13V ~ 5.5V
Program Memory Size:
48KB (48K x 8)
RAM Size:
4K x 8
Base Part Number:
S9S12
Program Memory Type:
FLASH
Packaging:
Cut Tape (CT)
Connectivity:
IrDA, LINbus, SCI, SPI
Manufacturer:
NXP USA Inc.
EEPROM Size:
1.5K x 8
Oscillator Type:
Internal
Number of I/O:
40
Core Size:
16-Bit
Mounting Type:
Surface Mount
Series:
HCS12
Supplier Device Package:
48-LQFP (7x7)
Data Converters:
A/D 12x10b
Customer Reference:
Core Processor:
12V1
Speed:
25MHz
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This is manufactured by NXP USA Inc.. The manufacturer part number is S9S12GN48F0MLFR. It features 12v1 hcs12 microcontroller ic 16-bit 25mhz 48kb (48k x 8) flash 48-lqfp (7x7). Moreover, the product comes in 48-lqfp. It has supplied with other peripherals, such as lvd, por, pwm, wdt. The product has -40°c ~ 125°c (ta) operating temperature range. The supply voltage of a bespoke product includes 3.13v ~ 5.5v. In addition, 48kb (48k x 8) is the program memory size. The product has typical 4k x 8 RAM size. Base Part Number: s9s12. It is a flash program memory type. In addition, cut tape (ct) is the available packaging type of the product. It provides connectivity solutions through irda, linbus, sci, spi. The nxp usa inc.'s product offers user-desired applications. Furthermore, 1.5k x 8 is the typical EEPROM size of the product. The product is a internal type of oscillator. 40 is the I/O value of the product. It has a core size 16-bit. The product is available in surface mount configuration. The product hcs12, is a highly preferred choice for users. 48-lqfp (7x7) is the supplier device package value. The typical data converters include a/d 12x10b. 12v1 is the product's core processor. It has a robust speed of 25mhz.

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Mult Dev Test Site 25/Mar/2021(PCN Assembly/Origin)
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NXP RoHS3 Cert(Environmental Information)
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MC9S12G DS Rev 10/May/2021(PCN Design/Specification)
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Mult Dev Pkg Seal 15/Dec/2020(PCN Packaging)
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All Dev Label Update 15/Dec/2020(PCN Packaging)

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