Microchip Technology DSPIC30F3013T-20I/ML

DSPIC30F3013T-20I-ML Microchip Technology DSPIC30F3013T-20I/ML
Microchip Technology

Product Information

HTSUS:
8542.31.0020
RoHS Status:
ROHS3 Compliant
Program Memory Size:
24KB (8K x 24)
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Operating Temperature:
-40°C ~ 85°C (TA)
Voltage - Supply (Vcc/Vdd):
2.5V ~ 5.5V
Package / Case:
44-VQFN Exposed Pad
RAM Size:
2K x 8
Data Converters:
A/D 10x12b
title:
DSPIC30F3013T-20I/ML
Program Memory Type:
FLASH
REACH Status:
REACH Unaffected
edacadModel:
DSPIC30F3013T-20I/ML Models
Connectivity:
I2C, SPI, UART/USART
edacadModelUrl:
/en/models/870341
EEPROM Size:
1K x 8
Oscillator Type:
Internal
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Number of I/O:
20
standardLeadTime:
6 Weeks
DigiKey Programmable:
Not Verified
Core Size:
16-Bit
Mounting Type:
Surface Mount
Series:
dsPIC™ 30F
Supplier Device Package:
44-QFN (8x8)
Packaging:
Tape & Reel (TR)
Core Processor:
dsPIC
Speed:
20 MIPS
Base Product Number:
DSPIC30F3013
ECCN:
3A991A2
Checking for live stock

This is manufactured by Microchip Technology. The manufacturer part number is DSPIC30F3013T-20I/ML. It is assigned with possible HTSUS value of 8542.31.0020. The product is rohs3 compliant. In addition, 24kb (8k x 24) is the program memory size. It has supplied with other peripherals, such as brown-out detect/reset, por, pwm, wdt. The product has -40°c ~ 85°c (ta) operating temperature range. The supply voltage of a bespoke product includes 2.5v ~ 5.5v. Moreover, the product comes in 44-vqfn exposed pad. The product has typical 2k x 8 RAM size. The typical data converters include a/d 10x12b. It is a flash program memory type. In addition, it is reach unaffected. It provides connectivity solutions through i2c, spi, uart/usart. Furthermore, 1k x 8 is the typical EEPROM size of the product. The product is a internal type of oscillator. Its typical moisture sensitivity level is 1 (unlimited). 20 is the I/O value of the product. It has a long 6 weeks standard lead time. It has a core size 16-bit. The product is available in surface mount configuration. The product dspic™ 30f, is a highly preferred choice for users. 44-qfn (8x8) is the supplier device package value. In addition, tape & reel (tr) is the available packaging type of the product. dspic is the product's core processor. It has a robust speed of 20 mips. Moreover, it corresponds to dspic30f3013, a base product number of the product. The product is designated with the 3a991a2 code number.

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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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Assembly Site 22/Nov/2023(PCN Assembly/Origin)
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Qual Bond Wire 17/Oct/2016(PCN Design/Specification)
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Plating 04/Jun/2013(PCN Design/Specification)
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dsPIC30F2011/2012/3012/3013(Datasheets)
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DSPIC30F Flash Programming Specification(Datasheets)
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dsPIC30F2010(Datasheets)
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Packing Changes 10/Oct/2016(PCN Packaging)
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Reel Design Update 07/May/2015(PCN Packaging)
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dsPIC30F Ref Manual Errata(Errata)

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