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This is manufactured by NXP USA Inc.. The manufacturer part number is LPC11E35FHI33/501E. It is assigned with possible HTSUS value of 8542.31.0025. The product is rohs3 compliant. In addition, 64kb (64k x 8) is the program memory size. It has supplied with other peripherals, such as brown-out detect/reset, por, wdt. The product has -40°c ~ 85°c (ta) operating temperature range. The supply voltage of a bespoke product includes 1.8v ~ 3.6v. Moreover, the product comes in 32-vfqfn exposed pad. The product has typical 12k x 8 RAM size. In addition, tray is the available packaging type of the product. It is a flash program memory type. In addition, it is reach unaffected. It provides connectivity solutions through i2c, microwire, smartcard, spi, ssp, uart/usart. Furthermore, 4k x 8 is the typical EEPROM size of the product. The product is a internal type of oscillator. Its typical moisture sensitivity level is 3 (168 hours). 26 is the I/O value of the product. It has a long 13 weeks standard lead time. It has a core size 32-bit single-core. The product is available in surface mount configuration. The product lpc11e3x, is a highly preferred choice for users. 32-hvqfn (5x5) is the supplier device package value. The typical data converters include a/d 8x10b. arm® cortex®-m0 is the product's core processor. It has a robust speed of 50mhz. Moreover, it corresponds to lpc11, a base product number of the product. The product is designated with the 3a991a2 code number.
For more information please check the datasheets.
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