NXP USA Inc. LPC1822JET100E

LPC1822JET100E NXP USA Inc.
NXP USA Inc.

Product Information

HTSUS:
8542.31.0025
RoHS Status:
ROHS3 Compliant
Program Memory Size:
512KB (512K x 8)
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Operating Temperature:
-40°C ~ 105°C (TA)
Voltage - Supply (Vcc/Vdd):
2.2V ~ 3.6V
Package / Case:
100-TFBGA
RAM Size:
104K x 8
Packaging:
Tray
title:
LPC1822JET100E
Program Memory Type:
FLASH
REACH Status:
REACH Unaffected
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
EEPROM Size:
16K x 8
Oscillator Type:
Internal
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Number of I/O:
49
standardLeadTime:
13 Weeks
DigiKey Programmable:
Not Verified
Core Size:
32-Bit Single-Core
Mounting Type:
Surface Mount
Series:
LPC18xx
Supplier Device Package:
100-TFBGA (9x9)
Data Converters:
A/D 4x10b; D/A 1x10b
Core Processor:
ARM® Cortex®-M3
Speed:
180MHz
Base Product Number:
LPC1822
ECCN:
3A991A2
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This is manufactured by NXP USA Inc.. The manufacturer part number is LPC1822JET100E. It is assigned with possible HTSUS value of 8542.31.0025. The product is rohs3 compliant. In addition, 512kb (512k x 8) is the program memory size. It has supplied with other peripherals, such as brown-out detect/reset, dma, i2s, por, wdt. The product has -40°c ~ 105°c (ta) operating temperature range. The supply voltage of a bespoke product includes 2.2v ~ 3.6v. Moreover, the product comes in 100-tfbga. The product has typical 104k x 8 RAM size. In addition, tray is the available packaging type of the product. It is a flash program memory type. In addition, it is reach unaffected. It provides connectivity solutions through canbus, ebi/emi, i2c, irda, microwire, sd, spi, ssi, ssp, uart/usart, usb, usb otg. Furthermore, 16k x 8 is the typical EEPROM size of the product. The product is a internal type of oscillator. Its typical moisture sensitivity level is 3 (168 hours). 49 is the I/O value of the product. It has a long 13 weeks standard lead time. It has a core size 32-bit single-core. The product is available in surface mount configuration. The product lpc18xx, is a highly preferred choice for users. 100-tfbga (9x9) is the supplier device package value. The typical data converters include a/d 4x10b; d/a 1x10b. arm® cortex®-m3 is the product's core processor. It has a robust speed of 180mhz. Moreover, it corresponds to lpc1822, a base product number of the product. The product is designated with the 3a991a2 code number.

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NXP USA Inc REACH(Environmental Information)
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NXP USA Inc RoHS Cert(Environmental Information)
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LPC185x,3x,2x,1x Datasheet(Datasheets)
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Mult Dev Pkg Seal 15/Dec/2020(PCN Packaging)
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All Dev Label Update 15/Dec/2020(PCN Packaging)

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