GigaDevice Semiconductor (HK) Limited GD25B32EEAGR

GigaDevice Semiconductor (HK) Limited

Product Information

Memory Interface:
SPI - Quad I/O
Write Cycle Time - Word, Page:
-
Operating Temperature:
-40°C ~ 125°C (TA)
Memory Size:
32Mbit
Package / Case:
8-XFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
title:
GD25B32EEAGR
Memory Organization:
4M x 8
standardLeadTime:
14 Weeks
Mounting Type:
Surface Mount
Series:
GD25B
Supplier Device Package:
8-USON (3x2)
Memory Type:
Non-Volatile
Voltage - Supply:
2.7V ~ 3.6V
Technology:
FLASH - NOR (SLC)
Memory Format:
FLASH
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This is manufactured by GigaDevice Semiconductor (HK) Limited. The manufacturer part number is GD25B32EEAGR. It is a spi - quad i/o memory interface. The product has -40°c ~ 125°c (ta) operating temperature range. It holds a typical memory size of 32mbit. Moreover, the product comes in 8-xfdfn exposed pad. In addition, tape & reel (tr) is the available packaging type of the product. While the product's memory is organised as 4m x 8. It has a long 14 weeks standard lead time. The product is available in surface mount configuration. The product gd25b, is a highly preferred choice for users. 8-uson (3x2) is the supplier device package value. It is a type of non-volatile memory type. It has optimum voltage supply of 2.7v ~ 3.6v. This product use flash - nor (slc) technology. It is a sort of flash memory.

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FAQs

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You can order GigaDevice Semiconductor (HK) Limited brand products with GD25B32EEAGR directly through our website or call us at +44 (0) 3303 800 157 or email our support team at sales@enrgtech.co.uk.
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