GigaDevice Semiconductor (HK) Limited GD25WB256EYIGR

GigaDevice Semiconductor (HK) Limited

Product Information

Memory Interface:
SPI - Quad I/O
Write Cycle Time - Word, Page:
150µs, 4ms
Operating Temperature:
-40°C ~ 85°C (TA)
Memory Size:
256Mbit
Package / Case:
8-WDFN Exposed Pad
Packaging:
Tape & Reel (TR)
title:
GD25WB256EYIGR
Memory Organization:
32M x 8
Clock Frequency:
104 MHz
Qualification:
-
standardLeadTime:
8 Weeks
Access Time:
7.5 ns
Mounting Type:
Surface Mount
Grade:
-
Series:
GD25WB
Supplier Device Package:
8-WSON (6x8)
Memory Type:
Non-Volatile
Voltage - Supply:
1.65V ~ 3.6V
Technology:
FLASH - NOR (SLC)
Memory Format:
FLASH
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This is manufactured by GigaDevice Semiconductor (HK) Limited. The manufacturer part number is GD25WB256EYIGR. It is a spi - quad i/o memory interface. It allows a 150µs, 4ms of write cycle time. The product has -40°c ~ 85°c (ta) operating temperature range. It holds a typical memory size of 256mbit. Moreover, the product comes in 8-wdfn exposed pad. In addition, tape & reel (tr) is the available packaging type of the product. While the product's memory is organised as 32m x 8. The product boasts a clock frequency of 104 mhz. It has a long 8 weeks standard lead time. It allows 7.5 ns access time. The product is available in surface mount configuration. The product gd25wb, is a highly preferred choice for users. 8-wson (6x8) is the supplier device package value. It is a type of non-volatile memory type. It has optimum voltage supply of 1.65v ~ 3.6v. This product use flash - nor (slc) technology. It is a sort of flash memory.

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FAQs

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