GigaDevice Semiconductor (HK) Limited GD25LX256EBARY

GigaDevice Semiconductor (HK) Limited

Product Information

Memory Interface:
SPI - Octal I/O, DTR
Write Cycle Time - Word, Page:
-
Operating Temperature:
-40°C ~ 125°C (TA)
Memory Size:
256Mbit
Package / Case:
24-TBGA
Packaging:
Tray
title:
GD25LX256EBARY
Memory Organization:
32M x 8
Qualification:
AEC-Q100
standardLeadTime:
14 Weeks
Mounting Type:
Surface Mount
Grade:
Automotive
Series:
GD25LX
Supplier Device Package:
24-TFBGA (6x8)
Memory Type:
Non-Volatile
Voltage - Supply:
1.65V ~ 2V
Technology:
FLASH - NOR (SLC)
Base Product Number:
GD25LX256
Memory Format:
FLASH
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This is manufactured by GigaDevice Semiconductor (HK) Limited. The manufacturer part number is GD25LX256EBARY. It is a spi - octal i/o, dtr memory interface. The product has -40°c ~ 125°c (ta) operating temperature range. It holds a typical memory size of 256mbit. Moreover, the product comes in 24-tbga. In addition, tray is the available packaging type of the product. While the product's memory is organised as 32m x 8. It has a long 14 weeks standard lead time. The product is available in surface mount configuration. The product is automotive, a grade of class. The product gd25lx, is a highly preferred choice for users. 24-tfbga (6x8) is the supplier device package value. It is a type of non-volatile memory type. It has optimum voltage supply of 1.65v ~ 2v. This product use flash - nor (slc) technology. Moreover, it corresponds to gd25lx256, a base product number of the product. It is a sort of flash memory.

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FAQs

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