Winbond Electronics W66AP6NBQAFJ

W66AP6NBQAFJ Winbond Electronics
Winbond Electronics

Product Information

HTSUS:
8542.32.0032
RoHS Status:
ROHS3 Compliant
Memory Interface:
LVSTL_11
Write Cycle Time - Word, Page:
18ns
Operating Temperature:
-40°C ~ 105°C (TC)
Memory Size:
1Gbit
Package / Case:
200-TFBGA
Packaging:
Tray
REACH Status:
REACH Unaffected
Memory Organization:
64M x 16
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Clock Frequency:
1.6 GHz
standardLeadTime:
16 Weeks
Access Time:
3.6 ns
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
200-TFBGA (10x14.5)
Memory Type:
Volatile
Voltage - Supply:
1.06V ~ 1.17V, 1.7V ~ 1.95V
ECCN:
EAR99
Technology:
SDRAM - Mobile LPDDR4
Memory Format:
DRAM
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This is manufactured by Winbond Electronics. The manufacturer part number is W66AP6NBQAFJ. It is assigned with possible HTSUS value of 8542.32.0032. The product is rohs3 compliant. It is a lvstl_11 memory interface. It allows a 18ns of write cycle time. The product has -40°c ~ 105°c (tc) operating temperature range. It holds a typical memory size of 1gbit. Moreover, the product comes in 200-tfbga. In addition, tray is the available packaging type of the product. In addition, it is reach unaffected. While the product's memory is organised as 64m x 16. Its typical moisture sensitivity level is 3 (168 hours). The product boasts a clock frequency of 1.6 ghz. It has a long 16 weeks standard lead time. It allows 3.6 ns access time. The product is available in surface mount configuration. 200-tfbga (10x14.5) is the supplier device package value. It is a type of volatile memory type. It has optimum voltage supply of 1.06v ~ 1.17v, 1.7v ~ 1.95v. The product is designated with the ear99 code number. This product use sdram - mobile lpddr4 technology. It is a sort of dram memory.

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