Infineon Technologies S29GL128S11TFIV20

S29GL128S11TFIV20 Infineon Technologies
Infineon Technologies

Product Information

HTSUS:
8542.32.0071
RoHS Status:
ROHS3 Compliant
DigiKey Programmable:
Verified
Memory Interface:
Parallel
Write Cycle Time - Word, Page:
60ns
Operating Temperature:
-40°C ~ 85°C (TA)
Memory Size:
128Mbit
Package / Case:
56-TFSOP (0.724", 18.40mm Width)
Packaging:
Tray
title:
S29GL128S11TFIV20
REACH Status:
REACH Unaffected
Memory Organization:
8M x 16
Moisture Sensitivity Level (MSL):
3 (168 Hours)
standardLeadTime:
8 Weeks
Access Time:
110 ns
Mounting Type:
Surface Mount
Series:
448
Supplier Device Package:
56-TSOP
Memory Type:
Non-Volatile
Voltage - Supply:
1.65V ~ 3.6V
ECCN:
3A991B1A
Technology:
FLASH - NOR
Base Product Number:
S29GL128
Memory Format:
FLASH
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This is manufactured by Infineon Technologies. The manufacturer part number is S29GL128S11TFIV20. It is assigned with possible HTSUS value of 8542.32.0071. The product is rohs3 compliant. It is a parallel memory interface. It allows a 60ns of write cycle time. The product has -40°c ~ 85°c (ta) operating temperature range. It holds a typical memory size of 128mbit. Moreover, the product comes in 56-tfsop (0.724", 18.40mm width). In addition, tray is the available packaging type of the product. In addition, it is reach unaffected. While the product's memory is organised as 8m x 16. Its typical moisture sensitivity level is 3 (168 hours). It has a long 8 weeks standard lead time. It allows 110 ns access time. The product is available in surface mount configuration. The product 448, is a highly preferred choice for users. 56-tsop is the supplier device package value. It is a type of non-volatile memory type. It has optimum voltage supply of 1.65v ~ 3.6v. The product is designated with the 3a991b1a code number. This product use flash - nor technology. Moreover, it corresponds to s29gl128, a base product number of the product. It is a sort of flash memory.

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Wafer Test Site 19/Jun/2019(PCN Assembly/Origin)
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Mold/Die Epoxy Alt 21/Oct/2015(PCN Design/Specification)
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Mold/Die Epoxy Addition 14/Dec/2015(PCN Design/Specification)
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Ship Label REV(PCN Packaging)

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FAQs

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