Micron Technology Inc. NAND02GW3B2DN6E

NAND02GW3B2DN6E Micron Technology Inc.
Micron Technology Inc.

Product Information

HTSUS:
8542.32.0051
RoHS Status:
ROHS3 Compliant
DigiKey Programmable:
Not Verified
Memory Interface:
Parallel
Write Cycle Time - Word, Page:
25ns
Operating Temperature:
-40°C ~ 85°C (TA)
Memory Size:
2Gbit
Package / Case:
48-TFSOP (0.724", 18.40mm Width)
REACH Status:
REACH Unaffected
Memory Organization:
256M x 8
Package:
Tray
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Access Time:
25 ns
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
48-TSOP
Memory Type:
Non-Volatile
Voltage - Supply:
2.7V ~ 3.6V
ECCN:
3A991B1A
Technology:
FLASH - NAND
Base Product Number:
NAND02G
Memory Format:
FLASH
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This is manufactured by Micron Technology Inc.. The manufacturer part number is NAND02GW3B2DN6E. It is assigned with possible HTSUS value of 8542.32.0051. The product is rohs3 compliant. It is a parallel memory interface. It allows a 25ns of write cycle time. The product has -40°c ~ 85°c (ta) operating temperature range. It holds a typical memory size of 2gbit. Moreover, the product comes in 48-tfsop (0.724", 18.40mm width). In addition, it is reach unaffected. While the product's memory is organised as 256m x 8. It is shipped in tray package . Its typical moisture sensitivity level is 3 (168 hours). It allows 25 ns access time. The product is available in surface mount configuration. 48-tsop is the supplier device package value. It is a type of non-volatile memory type. It has optimum voltage supply of 2.7v ~ 3.6v. The product is designated with the 3a991b1a code number. This product use flash - nand technology. Moreover, it corresponds to nand02g, a base product number of the product. It is a sort of flash memory.

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Tray Pkg Label Chgs 8/Oct/2020(PCN Assembly/Origin)
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NAND02GxxBxD(Datasheets)
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Standard Pkg Label Chg 20/Feb/2019(PCN Packaging)
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Memory 24-May-2022(PCN Packaging)

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