Micron Technology Inc. MT29F256G08EBHAFB16A3WEA

Micron Technology Inc.

Product Information

HTSUS:
0000.00.0000
Package / Case:
Die
Memory Interface:
Parallel
Write Cycle Time - Word, Page:
-
Operating Temperature:
0°C ~ 70°C (TA)
Memory Size:
256Gbit
DigiKey Programmable:
Not Verified
Packaging:
Bulk
REACH Status:
REACH Unaffected
Memory Organization:
32G x 8
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Clock Frequency:
333 MHz
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
Die
Memory Type:
Non-Volatile
Voltage - Supply:
2.5V ~ 3.6V
Technology:
FLASH - NAND (TLC)
Base Product Number:
MT29F256G08
Memory Format:
FLASH
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This is manufactured by Micron Technology Inc.. The manufacturer part number is MT29F256G08EBHAFB16A3WEA. It is assigned with possible HTSUS value of 0000.00.0000. Moreover, the product comes in die. It is a parallel memory interface. The product has 0°c ~ 70°c (ta) operating temperature range. It holds a typical memory size of 256gbit. In addition, bulk is the available packaging type of the product. In addition, it is reach unaffected. While the product's memory is organised as 32g x 8. Its typical moisture sensitivity level is 3 (168 hours). The product boasts a clock frequency of 333 mhz. The product is available in surface mount configuration. die is the supplier device package value. It is a type of non-volatile memory type. It has optimum voltage supply of 2.5v ~ 3.6v. This product use flash - nand (tlc) technology. Moreover, it corresponds to mt29f256g08, a base product number of the product. It is a sort of flash memory.

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Tray 05-May-2022(PCN Packaging)

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