Cypress Semiconductor Corp S34ML08G201BHA000

S34ML08G201BHA000 Cypress Semiconductor Corp
Cypress Semiconductor Corp

Product Information

HTSUS:
8542.32.0071
RoHS Status:
ROHS3 Compliant
DigiKey Programmable:
Not Verified
Memory Interface:
Parallel
Write Cycle Time - Word, Page:
25ns
Operating Temperature:
-40°C ~ 85°C (TA)
Memory Size:
8Gbit
Package / Case:
63-VFBGA
REACH Status:
REACH Unaffected
Memory Organization:
1G x 8
Package:
Tray
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Grade:
Automotive
Series:
ML-2
Supplier Device Package:
63-BGA (11x9)
Memory Type:
Non-Volatile
Voltage - Supply:
2.7V ~ 3.6V
ECCN:
3A991B1A
Technology:
FLASH - NAND
Base Product Number:
S34ML08
Memory Format:
FLASH
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This is manufactured by Cypress Semiconductor Corp. The manufacturer part number is S34ML08G201BHA000. It is assigned with possible HTSUS value of 8542.32.0071. The product is rohs3 compliant. It is a parallel memory interface. It allows a 25ns of write cycle time. The product has -40°c ~ 85°c (ta) operating temperature range. It holds a typical memory size of 8gbit. Moreover, the product comes in 63-vfbga. In addition, it is reach unaffected. While the product's memory is organised as 1g x 8. It is shipped in tray package . Its typical moisture sensitivity level is 3 (168 hours). The product is available in surface mount configuration. The product is automotive, a grade of class. The product ml-2, is a highly preferred choice for users. 63-bga (11x9) is the supplier device package value. It is a type of non-volatile memory type. It has optimum voltage supply of 2.7v ~ 3.6v. The product is designated with the 3a991b1a code number. This product use flash - nand technology. Moreover, it corresponds to s34ml08, a base product number of the product. It is a sort of flash memory.

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Mult Devices 01/Apr/2019(PCN Other)
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Mult Device Serial No Mark 26/Sep/2017(PCN Design/Specification)
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Ship Label/Document Standardization 24/Jan/2018(PCN Packaging)
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Mult Devices 19/Jul/2017(PCN Packaging)

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FAQs

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