Cypress Semiconductor Corp S29WS256PABBAW000

S29WS256PABBAW000 Cypress Semiconductor Corp
Cypress Semiconductor Corp

Product Information

HTSUS:
8542.32.0071
RoHS Status:
RoHS non-compliant
Memory Interface:
Parallel
Write Cycle Time - Word, Page:
60ns
Operating Temperature:
-25°C ~ 85°C (TA)
Memory Size:
256Mb (16M x 16)
Package / Case:
84-VFBGA
REACH Status:
REACH Unaffected
Package:
Tray
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Clock Frequency:
104 MHz
Access Time:
80 ns
Mounting Type:
Surface Mount
Series:
WS-P
Supplier Device Package:
84-FBGA (11.6x8)
Memory Type:
Non-Volatile
Voltage - Supply:
1.7V ~ 1.95V
ECCN:
3A991B1A
Technology:
FLASH - NOR
Base Product Number:
S29WS256
Memory Format:
FLASH
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This is manufactured by Cypress Semiconductor Corp. The manufacturer part number is S29WS256PABBAW000. It is assigned with possible HTSUS value of 8542.32.0071. The product is rohs non-compliant. It is a parallel memory interface. It allows a 60ns of write cycle time. The product has -25°c ~ 85°c (ta) operating temperature range. It holds a typical memory size of 256mb (16m x 16). Moreover, the product comes in 84-vfbga. In addition, it is reach unaffected. It is shipped in tray package . Its typical moisture sensitivity level is 3 (168 hours). The product boasts a clock frequency of 104 mhz. It allows 80 ns access time. The product is available in surface mount configuration. The product ws-p, is a highly preferred choice for users. 84-fbga (11.6x8) is the supplier device package value. It is a type of non-volatile memory type. It has optimum voltage supply of 1.7v ~ 1.95v. The product is designated with the 3a991b1a code number. This product use flash - nor technology. Moreover, it corresponds to s29ws256, a base product number of the product. It is a sort of flash memory.

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Die Epoxy Chg 05/Nov/2015(PCN Design/Specification)
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Mult Device Serial No Mark 26/Sep/2017(PCN Design/Specification)
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Mult Dev EOL 20/Oct/2020(PCN Obsolescence/ EOL)
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Date Code/Shelf Life Chgs 18/Jul/2019(PCN Packaging)
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Ship Label REV(PCN Packaging)

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FAQs

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