Microchip Technology AT28LV64B-20SC

AT28LV64B-20SC Microchip Technology
Microchip Technology

Product Information

HTSUS:
8542.32.0051
RoHS Status:
RoHS non-compliant
DigiKey Programmable:
Not Verified
Memory Interface:
Parallel
Write Cycle Time - Word, Page:
10ms
Operating Temperature:
0°C ~ 70°C (TC)
Memory Size:
64Kbit
Package / Case:
28-SOIC (0.295", 7.50mm Width)
REACH Status:
REACH Unaffected
edacadModel:
AT28LV64B-20SC Models
edacadModelUrl:
/en/models/399091
Memory Organization:
8K x 8
Package:
Tube
Moisture Sensitivity Level (MSL):
2 (1 Year)
Access Time:
200 ns
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
28-SOIC
Memory Type:
Non-Volatile
Voltage - Supply:
3V ~ 3.6V
ECCN:
EAR99
Technology:
EEPROM
Base Product Number:
AT28LV64
Memory Format:
EEPROM
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This is manufactured by Microchip Technology. The manufacturer part number is AT28LV64B-20SC. It is assigned with possible HTSUS value of 8542.32.0051. The product is rohs non-compliant. It is a parallel memory interface. It allows a 10ms of write cycle time. The product has 0°c ~ 70°c (tc) operating temperature range. It holds a typical memory size of 64kbit. Moreover, the product comes in 28-soic (0.295", 7.50mm width). In addition, it is reach unaffected. While the product's memory is organised as 8k x 8. It is shipped in tube package . Its typical moisture sensitivity level is 2 (1 year). It allows 200 ns access time. The product is available in surface mount configuration. 28-soic is the supplier device package value. It is a type of non-volatile memory type. It has optimum voltage supply of 3v ~ 3.6v. The product is designated with the ear99 code number. This product use eeprom technology. Moreover, it corresponds to at28lv64, a base product number of the product. It is a sort of eeprom memory.

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AT28LV64B(Datasheets)
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Microchip CA Prop65(Environmental Information)
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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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Transfer to Microchip/Label/Pkg 5/Sep/2016(PCN Packaging)
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MBB/Label Chgs 16/Nov/2018(PCN Packaging)

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FAQs

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