Cypress Semiconductor Corp CY7C2170KV18-550BZXC

CY7C2170KV18-550BZXC Cypress Semiconductor Corp
Cypress Semiconductor Corp

Product Information

HTSUS:
8542.32.0041
RoHS Status:
ROHS3 Compliant
Memory Interface:
Parallel
Write Cycle Time - Word, Page:
-
Operating Temperature:
0°C ~ 70°C (TA)
Memory Size:
18Mb (512K x 36)
Package / Case:
165-LBGA
REACH Status:
REACH Unaffected
Package:
Tray
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Clock Frequency:
550 MHz
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
165-FBGA (13x15)
Memory Type:
Volatile
Voltage - Supply:
1.7V ~ 1.9V
ECCN:
3A991B2A
Technology:
SRAM - Synchronous, DDR II+
Base Product Number:
CY7C2170
Memory Format:
SRAM
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This is manufactured by Cypress Semiconductor Corp. The manufacturer part number is CY7C2170KV18-550BZXC. It is assigned with possible HTSUS value of 8542.32.0041. The product is rohs3 compliant. It is a parallel memory interface. The product has 0°c ~ 70°c (ta) operating temperature range. It holds a typical memory size of 18mb (512k x 36). Moreover, the product comes in 165-lbga. In addition, it is reach unaffected. It is shipped in tray package . Its typical moisture sensitivity level is 3 (168 hours). The product boasts a clock frequency of 550 mhz. The product is available in surface mount configuration. 165-fbga (13x15) is the supplier device package value. It is a type of volatile memory type. It has optimum voltage supply of 1.7v ~ 1.9v. The product is designated with the 3a991b2a code number. This product use sram - synchronous, ddr ii+ technology. Moreover, it corresponds to cy7c2170, a base product number of the product. It is a sort of sram memory.

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Qualification of Die Attach Film 13/Dec/2013(PCN Assembly/Origin)
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Mult Dev Mark REV 9/Jul/2018(PCN Design/Specification)
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Multiple Updates 27/Mar/2015(PCN Other)
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Date Code/Shelf Life Chgs 18/Jul/2019(PCN Packaging)
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Ship Label REV(PCN Packaging)

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