Microchip Technology 25LC1024-E/SM

25LC1024-E-SM Microchip Technology 25LC1024-E/SM
25LC1024-E/SM
Microchip Technology

Product Information

HTSUS:
8542.32.0051
RoHS Status:
ROHS3 Compliant
DigiKey Programmable:
Verified
Memory Interface:
SPI
Write Cycle Time - Word, Page:
6ms
Operating Temperature:
-40°C ~ 125°C (TA)
Memory Size:
1Mbit
Package / Case:
8-SOIC (0.209", 5.30mm Width)
REACH Status:
REACH Unaffected
edacadModel:
25LC1024-E/SM Models
edacadModelUrl:
/en/models/1228573
Memory Organization:
128K x 8
Package:
Tube
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Clock Frequency:
20 MHz
standardLeadTime:
5 Weeks
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIJ
Memory Type:
Non-Volatile
Voltage - Supply:
2.5V ~ 5.5V
ECCN:
EAR99
Technology:
EEPROM
Base Product Number:
25LC1024
Memory Format:
EEPROM
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This is manufactured by Microchip Technology. The manufacturer part number is 25LC1024-E/SM. It is assigned with possible HTSUS value of 8542.32.0051. The product is rohs3 compliant. It is a spi memory interface. It allows a 6ms of write cycle time. The product has -40°c ~ 125°c (ta) operating temperature range. It holds a typical memory size of 1mbit. Moreover, the product comes in 8-soic (0.209", 5.30mm width). In addition, it is reach unaffected. While the product's memory is organised as 128k x 8. It is shipped in tube package . Its typical moisture sensitivity level is 1 (unlimited). The product boasts a clock frequency of 20 mhz. It has a long 5 weeks standard lead time. The product is available in surface mount configuration. 8-soij is the supplier device package value. It is a type of non-volatile memory type. It has optimum voltage supply of 2.5v ~ 5.5v. The product is designated with the ear99 code number. This product use eeprom technology. Moreover, it corresponds to 25lc1024, a base product number of the product. It is a sort of eeprom memory.

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Microchip CA Prop65(Environmental Information)
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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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8L SOIJ Package/Plating 31/Jul/2013(PCN Assembly/Origin)
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Bond Wire 18/Oct/2016(PCN Design/Specification)
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25LC1024 18/Aug/2021(PCN Design/Specification)
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25LC1024(Datasheets)
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Packing Changes 10/Oct/2016(PCN Packaging)
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Label and Packing Changes 23/Sep/2015(PCN Packaging)

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FAQs

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