Microchip Technology 25LC160C-E/ST

25LC160C-E-ST Microchip Technology 25LC160C-E/ST
Microchip Technology

Product Information

HTSUS:
8542.32.0051
RoHS Status:
ROHS3 Compliant
DigiKey Programmable:
Not Verified
Memory Interface:
SPI
Write Cycle Time - Word, Page:
5ms
Operating Temperature:
-40°C ~ 125°C (TA)
Memory Size:
16Kbit
Package / Case:
8-TSSOP (0.173", 4.40mm Width)
REACH Status:
REACH Unaffected
edacadModel:
25LC160C-E/ST Models
edacadModelUrl:
/en/models/2126028
Memory Organization:
2K x 8
Package:
Tube
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Clock Frequency:
10 MHz
standardLeadTime:
6 Weeks
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-TSSOP
Memory Type:
Non-Volatile
Voltage - Supply:
2.5V ~ 5.5V
ECCN:
EAR99
Technology:
EEPROM
Base Product Number:
25LC160
Memory Format:
EEPROM
Checking for live stock

This is manufactured by Microchip Technology. The manufacturer part number is 25LC160C-E/ST. It is assigned with possible HTSUS value of 8542.32.0051. The product is rohs3 compliant. It is a spi memory interface. It allows a 5ms of write cycle time. The product has -40°c ~ 125°c (ta) operating temperature range. It holds a typical memory size of 16kbit. Moreover, the product comes in 8-tssop (0.173", 4.40mm width). In addition, it is reach unaffected. While the product's memory is organised as 2k x 8. It is shipped in tube package . Its typical moisture sensitivity level is 1 (unlimited). The product boasts a clock frequency of 10 mhz. It has a long 6 weeks standard lead time. The product is available in surface mount configuration. 8-tssop is the supplier device package value. It is a type of non-volatile memory type. It has optimum voltage supply of 2.5v ~ 5.5v. The product is designated with the ear99 code number. This product use eeprom technology. Moreover, it corresponds to 25lc160, a base product number of the product. It is a sort of eeprom memory.

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Microchip CA Prop65(Environmental Information)
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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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Bond Wire 28/Mar/2022(PCN Assembly/Origin)
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25LCYYY 18/Sep/2018(PCN Design/Specification)
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25AA160C/D-25LC160C/D 18/Nov/2021(PCN Design/Specification)
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25AA160(C,D), 25LC160(C,D)(Datasheets)
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Packing Changes 10/Oct/2016(PCN Packaging)
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Label and Packing Changes 23/Sep/2015(PCN Packaging)

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FAQs

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