Samsung Semiconductor, Inc. SI-B8U261280WW

Samsung Semiconductor, Inc.

Product Information

HTSUS:
8541.41.0000
Current - Test:
1.12A
CCT (K):
3500K 3-Step MacAdam Ellipse
Type:
LED Module
Lens Type:
Flat
Current - Max:
1.8A
Viewing Angle:
-
Light Emitting Surface (LES):
-
Configuration:
Linear Light Strip
Manufacturer:
Samsung Semiconductor, Inc.
Luminous Flux @ Current/Temperature:
4400lm (3960lm ~ 4890lm)
Size / Dimension:
279.70mm L x 39.80mm W
Temperature - Test:
65°C
Voltage - Forward (Vf) (Typ):
23V
CRI (Color Rendering Index):
80
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Features:
-
Color:
White, Warm
Series:
F-Series Gen3
Height:
5.20mm
Packaging:
Tray
Lumens/Watt @ Current - Test:
171 lm/W
Wavelength:
-
Base Product Number:
SI-B8
ECCN:
EAR99
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This is manufactured by Samsung Semiconductor, Inc.. The manufacturer part number is SI-B8U261280WW. It is assigned with possible HTSUS value of 8541.41.0000. The given current test of the product is [Current -Test]. In addition, 3500k 3-step macadam ellipse is the given CCT value of the product. It comes in led module configuration. It is supplied with a flat lens. The given maximum current is 1.8a. The product is available in linear light strip configuration. The samsung semiconductor, inc.'s product offers user-desired applications. The luminous flux of the product is 4400lm (3960lm ~ 4890lm). The product's diameters include 279.70mm l x 39.80mm w. The product's test temperature is 65°c. The typical forward voltage (Vf) of the product is 23v. The product is supplied with CRI number 80. Its typical moisture sensitivity level is 1 (unlimited). It has a classic white, warm colour. The product f-series gen3, is a highly preferred choice for users. In addition, the height is 5.20mm. In addition, tray is the available packaging type of the product. 171 lm/w of watts at test current. Moreover, it corresponds to si-b8, a base product number of the product. The product is designated with the ear99 code number.

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SI-B8A131560WW EOL 20/Apr/2021(PCN Obsolescence/ EOL)
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Linear Platform Modules(Datasheets)
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F-Series Gen3(Datasheets)
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Mult Dev Des Chgs 5/Jan/2020(PCN Design/Specification)
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All Dev Label Chg Sep/2020(PCN Packaging)

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