Texas Instruments TLV2452AID

TLV2452AID Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Current - Output / Channel:
10 mA
Operating Temperature:
-40°C ~ 125°C
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Current - Input Bias:
500 pA
Voltage - Input Offset:
300 µV
Voltage - Supply Span (Max):
6 V
Voltage - Supply Span (Min):
2.7 V
REACH Status:
REACH Unaffected
Output Type:
Rail-to-Rail
edacadModel:
TLV2452AID Models
Current - Supply:
23µA (x2 Channels)
edacadModelUrl:
/en/models/1677591
Package:
Tube
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Slew Rate:
0.11V/µs
standardLeadTime:
6 Weeks
Number of Circuits:
2
Gain Bandwidth Product:
220 kHz
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIC
Amplifier Type:
General Purpose
Base Product Number:
TLV2452
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is TLV2452AID. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. It carries 10 ma output or channel current. The product has -40°c ~ 125°c operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). The typical current - input bias includes 500 pa. The input offset voltage is 300 µv. The maximum voltage supply span of the product is 6 v. While the minimum voltage supply is 2.7 v. In addition, it is reach unaffected. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 23µa (x2 channels). It is shipped in tube package . Its typical moisture sensitivity level is 1 (unlimited). The 0.11v/µs is the slew rate of the product. It has a long 6 weeks standard lead time. It integrates 2 circuits. The gain bandwidth product is 220 khz. The product is available in surface mount configuration. 8-soic is the supplier device package value. It is a sort of a general purpose amplifier. Moreover, it corresponds to tlv2452, a base product number of the product. The product is designated with the ear99 code number.

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Assembly/Wafer Fab Site 31/Jul/2023(PCN Assembly/Origin)
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TLV2450-55, TLV245xA(Datasheets)
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Design 25/Feb/2022(PCN Design/Specification)
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Mult Devices Font 21/Apr/2018(PCN Design/Specification)

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