Texas Instruments LMV358M

LMV358M Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Current - Output / Channel:
160 mA
Operating Temperature:
-40°C ~ 125°C
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Current - Input Bias:
15 nA
Voltage - Supply Span (Max):
5.5 V
Voltage - Supply Span (Min):
2.7 V
REACH Status:
REACH Affected
Output Type:
Rail-to-Rail
edacadModel:
LMV358M Models
Current - Supply:
210µA (x2 Channels)
edacadModelUrl:
/en/models/2605872
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Slew Rate:
1V/µs
Voltage - Input Offset:
1.7 mV
Number of Circuits:
2
Gain Bandwidth Product:
1 MHz
Mounting Type:
Surface Mount
Series:
LMV®
Supplier Device Package:
8-SOIC
Packaging:
Tube
Amplifier Type:
General Purpose
Base Product Number:
LMV358
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LMV358M. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. It carries 160 ma output or channel current. The product has -40°c ~ 125°c operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). The typical current - input bias includes 15 na. The maximum voltage supply span of the product is 5.5 v. While the minimum voltage supply is 2.7 v. In addition, it is reach affected. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 210µa (x2 channels). Its typical moisture sensitivity level is 1 (unlimited). The 1v/µs is the slew rate of the product. The input offset voltage is 1.7 mv. It integrates 2 circuits. The gain bandwidth product is 1 mhz. The product is available in surface mount configuration. The product lmv®, is a highly preferred choice for users. 8-soic is the supplier device package value. In addition, tube is the available packaging type of the product. It is a sort of a general purpose amplifier. Moreover, it corresponds to lmv358, a base product number of the product. The product is designated with the ear99 code number.

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Metal One Composition Update 17/Jul/2014(PCN Assembly/Origin)
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LMV3yy 15/Sep/2020(PCN Design/Specification)
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SOIC Pkg Wire Bonding 20/Mar/2013(PCN Design/Specification)
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EOL 16/Oct/2023(PCN Obsolescence/ EOL)

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