Texas Instruments LMV932MA

LMV932MA Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
RoHS non-compliant
Current - Output / Channel:
100 mA
Operating Temperature:
-40°C ~ 125°C (TA)
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Current - Input Bias:
14 nA
Voltage - Supply Span (Max):
5.5 V
edacadModel:
LMV932MA Models
Voltage - Supply Span (Min):
1.8 V
REACH Status:
REACH Unaffected
Output Type:
Rail-to-Rail
Current - Supply:
116µA (x2 Channels)
edacadModelUrl:
/en/models/3695491
Package:
Tube
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Slew Rate:
0.42V/µs
Voltage - Input Offset:
1 mV
Number of Circuits:
2
Gain Bandwidth Product:
1.5 MHz
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIC
Amplifier Type:
General Purpose
Base Product Number:
LMV932
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LMV932MA. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs non-compliant. It carries 100 ma output or channel current. The product has -40°c ~ 125°c (ta) operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). The typical current - input bias includes 14 na. The maximum voltage supply span of the product is 5.5 v. While the minimum voltage supply is 1.8 v. In addition, it is reach unaffected. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 116µa (x2 channels). It is shipped in tube package . Its typical moisture sensitivity level is 1 (unlimited). The 0.42v/µs is the slew rate of the product. The input offset voltage is 1 mv. It integrates 2 circuits. The gain bandwidth product is 1.5 mhz. The product is available in surface mount configuration. 8-soic is the supplier device package value. It is a sort of a general purpose amplifier. Moreover, it corresponds to lmv932, a base product number of the product. The product is designated with the ear99 code number.

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SOIC Pkg Wire Bonding Update 24/Jul/2013(PCN Design/Specification)
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SOIC Pkg Wire Bonding 20/Mar/2013(PCN Design/Specification)

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