Texas Instruments LM358BAIDR

LM358BAIDR Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Current - Output / Channel:
40 mA
Operating Temperature:
-40°C ~ 125°C (TA)
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Current - Input Bias:
10 nA
Voltage - Input Offset:
2 mV
Voltage - Supply Span (Max):
36 V
Voltage - Supply Span (Min):
3 V
REACH Status:
REACH Unaffected
Output Type:
-
edacadModel:
LM358BAIDR Models
Current - Supply:
300µA (x2 Channels)
edacadModelUrl:
/en/models/10715497
Package:
Tape & Reel (TR)
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Slew Rate:
0.5V/µs
standardLeadTime:
6 Weeks
Number of Circuits:
2
Gain Bandwidth Product:
1.2 MHz
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIC
Amplifier Type:
General Purpose
Base Product Number:
LM358
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LM358BAIDR. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. It carries 40 ma output or channel current. The product has -40°c ~ 125°c (ta) operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). The typical current - input bias includes 10 na. The input offset voltage is 2 mv. The maximum voltage supply span of the product is 36 v. While the minimum voltage supply is 3 v. In addition, it is reach unaffected. The current - supply of a bespoke product is 300µa (x2 channels). It is shipped in tape & reel (tr) package . Its typical moisture sensitivity level is 1 (unlimited). The 0.5v/µs is the slew rate of the product. It has a long 6 weeks standard lead time. It integrates 2 circuits. The gain bandwidth product is 1.2 mhz. The product is available in surface mount configuration. 8-soic is the supplier device package value. It is a sort of a general purpose amplifier. Moreover, it corresponds to lm358, a base product number of the product. The product is designated with the ear99 code number.

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Mult Changes 15/Feb/2021(PCN Assembly/Origin)
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Mult Dev 27/Jul/2023(PCN Design/Specification)
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Design 25/Feb/2022(PCN Design/Specification)

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