Texas Instruments LMV822MX

LMV822MX Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Current - Output / Channel:
45 mA
Operating Temperature:
-40°C ~ 85°C
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Current - Input Bias:
40 nA
Voltage - Supply Span (Max):
5.5 V
Voltage - Supply Span (Min):
2.5 V
REACH Status:
REACH Unaffected
Output Type:
Rail-to-Rail
edacadModel:
LMV822MX Models
Current - Supply:
500µA (x2 Channels)
edacadModelUrl:
/en/models/3698114
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Slew Rate:
2V/µs
Voltage - Input Offset:
1 mV
Number of Circuits:
2
Gain Bandwidth Product:
5.6 MHz
Mounting Type:
Surface Mount
Series:
LMV®
Supplier Device Package:
8-SOIC
Packaging:
Tape & Reel (TR)
Amplifier Type:
General Purpose
Base Product Number:
LMV822
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LMV822MX. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. It carries 45 ma output or channel current. The product has -40°c ~ 85°c operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). The typical current - input bias includes 40 na. The maximum voltage supply span of the product is 5.5 v. While the minimum voltage supply is 2.5 v. In addition, it is reach unaffected. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 500µa (x2 channels). Its typical moisture sensitivity level is 1 (unlimited). The 2v/µs is the slew rate of the product. The input offset voltage is 1 mv. It integrates 2 circuits. The gain bandwidth product is 5.6 mhz. The product is available in surface mount configuration. The product lmv®, is a highly preferred choice for users. 8-soic is the supplier device package value. In addition, tape & reel (tr) is the available packaging type of the product. It is a sort of a general purpose amplifier. Moreover, it corresponds to lmv822, a base product number of the product. The product is designated with the ear99 code number.

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Wafer Metal Update 30/Nov/2016(PCN Assembly/Origin)
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LMV82X 25/Jul/2016(PCN Design/Specification)
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SOIC Pkg Wire Bonding 20/Mar/2013(PCN Design/Specification)
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EOL 16/Oct/2023(PCN Obsolescence/ EOL)

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