Texas Instruments LMP7716Q MDA

Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Current - Output / Channel:
66 mA
Operating Temperature:
-40°C ~ 125°C
Package / Case:
Die
Current - Input Bias:
0.1 pA
Voltage - Input Offset:
10 µV
Voltage - Supply Span (Max):
5.5 V
Voltage - Supply Span (Min):
1.8 V
REACH Status:
REACH Unaffected
Output Type:
Rail-to-Rail
Current - Supply:
1.3mA (x2 Channels)
Package:
Tube
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Slew Rate:
11.5V/µs
Qualification:
AEC-Q100
standardLeadTime:
12 Weeks
Number of Circuits:
2
Gain Bandwidth Product:
17 MHz
Mounting Type:
Surface Mount
Grade:
Automotive
Series:
LMP®
Supplier Device Package:
Die
Amplifier Type:
General Purpose
Base Product Number:
LMP7716
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LMP7716Q MDA. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. It carries 66 ma output or channel current. The product has -40°c ~ 125°c operating temperature range. Moreover, the product comes in die. The typical current - input bias includes 0.1 pa. The input offset voltage is 10 µv. The maximum voltage supply span of the product is 5.5 v. While the minimum voltage supply is 1.8 v. In addition, it is reach unaffected. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 1.3ma (x2 channels). It is shipped in tube package . Its typical moisture sensitivity level is 1 (unlimited). The 11.5v/µs is the slew rate of the product. It has a long 12 weeks standard lead time. It integrates 2 circuits. The gain bandwidth product is 17 mhz. The product is available in surface mount configuration. The product is automotive, a grade of class. The product lmp®, is a highly preferred choice for users. die is the supplier device package value. It is a sort of a general purpose amplifier. Moreover, it corresponds to lmp7716, a base product number of the product. The product is designated with the ear99 code number.

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LMP7716Q(Datasheets)
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Wafer Sales Inking Process Removal 15/Sept/2023(PCN Packaging)

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