Texas Instruments LMP2012MA

LMP2012MA Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
RoHS non-compliant
Current - Output / Channel:
17 mA
Operating Temperature:
-40°C ~ 125°C
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Current - Input Bias:
3 pA
Voltage - Supply Span (Max):
5.25 V
Voltage - Supply Span (Min):
2.7 V
REACH Status:
REACH Unaffected
Output Type:
Rail-to-Rail
edacadModel:
LMP2012MA Models
Current - Supply:
930µA
edacadModelUrl:
/en/models/3695460
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Slew Rate:
4V/µs
Voltage - Input Offset:
0.12 µV
Number of Circuits:
2
Gain Bandwidth Product:
3 MHz
Mounting Type:
Surface Mount
Series:
LMP®
Supplier Device Package:
8-SOIC
Packaging:
Tube
Amplifier Type:
General Purpose
Base Product Number:
LMP2012
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LMP2012MA. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs non-compliant. It carries 17 ma output or channel current. The product has -40°c ~ 125°c operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). The typical current - input bias includes 3 pa. The maximum voltage supply span of the product is 5.25 v. While the minimum voltage supply is 2.7 v. In addition, it is reach unaffected. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 930µa. Its typical moisture sensitivity level is 1 (unlimited). The 4v/µs is the slew rate of the product. The input offset voltage is 0.12 µv. It integrates 2 circuits. The gain bandwidth product is 3 mhz. The product is available in surface mount configuration. The product lmp®, is a highly preferred choice for users. 8-soic is the supplier device package value. In addition, tube is the available packaging type of the product. It is a sort of a general purpose amplifier. Moreover, it corresponds to lmp2012, a base product number of the product. The product is designated with the ear99 code number.

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SOIC Pkg Wire Bonding 20/Mar/2013(PCN Design/Specification)

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