Texas Instruments LMC6484IN

LMC6484IN Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
RoHS non-compliant
Current - Output / Channel:
30 mA
Operating Temperature:
-40°C ~ 85°C (TJ)
Package / Case:
14-DIP (0.300", 7.62mm)
Current - Input Bias:
0.02 pA
Voltage - Supply Span (Max):
15.5 V
Voltage - Supply Span (Min):
3 V
REACH Status:
REACH Unaffected
Output Type:
Rail-to-Rail
edacadModel:
LMC6484IN Models
Current - Supply:
2.6mA (x4 Channels)
edacadModelUrl:
/en/models/3695393
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Slew Rate:
1.3V/µs
Voltage - Input Offset:
110 µV
Number of Circuits:
4
Gain Bandwidth Product:
1.5 MHz
Mounting Type:
Through Hole
Series:
-
Supplier Device Package:
14-PDIP
Packaging:
Tube
Amplifier Type:
CMOS
Base Product Number:
LMC6484
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LMC6484IN. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs non-compliant. It carries 30 ma output or channel current. The product has -40°c ~ 85°c (tj) operating temperature range. Moreover, the product comes in 14-dip (0.300", 7.62mm). The typical current - input bias includes 0.02 pa. The maximum voltage supply span of the product is 15.5 v. While the minimum voltage supply is 3 v. In addition, it is reach unaffected. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 2.6ma (x4 channels). Its typical moisture sensitivity level is 1 (unlimited). The 1.3v/µs is the slew rate of the product. The input offset voltage is 110 µv. It integrates 4 circuits. The gain bandwidth product is 1.5 mhz. The product is available in through hole configuration. 14-pdip is the supplier device package value. In addition, tube is the available packaging type of the product. It is a sort of a cmos amplifier. Moreover, it corresponds to lmc6484, a base product number of the product. The product is designated with the ear99 code number.

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SnPb MDIP Devices 11/Feb/2014(PCN Obsolescence/ EOL)
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Mold Compound Updated 10/Jul/2014(PCN Design/Specification)

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