Texas Instruments TLE2072CDR

TLE2072CDR Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Current - Output / Channel:
48 mA
Operating Temperature:
0°C ~ 70°C
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Current - Input Bias:
1 pA
Voltage - Input Offset:
300 µV
Voltage - Supply Span (Max):
38 V
Voltage - Supply Span (Min):
4.5 V
REACH Status:
REACH Unaffected
Output Type:
-
edacadModel:
TLE2072CDR Models
Current - Supply:
3.1mA (x2 Channels)
edacadModelUrl:
/en/models/276985
Package:
Tape & Reel (TR)
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Slew Rate:
45V/µs
standardLeadTime:
6 Weeks
Number of Circuits:
2
Gain Bandwidth Product:
10 MHz
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIC
Amplifier Type:
J-FET
Base Product Number:
TLE2072
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is TLE2072CDR. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. It carries 48 ma output or channel current. The product has 0°c ~ 70°c operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). The typical current - input bias includes 1 pa. The input offset voltage is 300 µv. The maximum voltage supply span of the product is 38 v. While the minimum voltage supply is 4.5 v. In addition, it is reach unaffected. The current - supply of a bespoke product is 3.1ma (x2 channels). It is shipped in tape & reel (tr) package . Its typical moisture sensitivity level is 1 (unlimited). The 45v/µs is the slew rate of the product. It has a long 6 weeks standard lead time. It integrates 2 circuits. The gain bandwidth product is 10 mhz. The product is available in surface mount configuration. 8-soic is the supplier device package value. It is a sort of a j-fet amplifier. Moreover, it corresponds to tle2072, a base product number of the product. The product is designated with the ear99 code number.

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Design 25/Feb/2022(PCN Design/Specification)
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Mult Dev Assembly Wafer Fab Site/Design 22/Dec/2023(PCN Design/Specification)

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