Microchip Technology MCP6N11T-100E/MNY

MCP6N11T-100E-MNY Microchip Technology MCP6N11T-100E/MNY
Microchip Technology

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Operating Temperature:
-40°C ~ 125°C
Package / Case:
8-WFDFN Exposed Pad
Current - Input Bias:
10 pA
Voltage - Input Offset:
350 µV
Voltage - Supply Span (Max):
5.5 V
Voltage - Supply Span (Min):
1.8 V
REACH Status:
REACH Unaffected
Output Type:
Rail-to-Rail
edacadModel:
MCP6N11T-100E/MNY Models
Current - Supply:
800µA
edacadModelUrl:
/en/models/2775795
Package:
Tape & Reel (TR)
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Slew Rate:
6V/µs
standardLeadTime:
6 Weeks
Number of Circuits:
1
Gain Bandwidth Product:
35 MHz
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-TDFN (2x3)
Amplifier Type:
Instrumentation
Base Product Number:
MCP6N11
ECCN:
EAR99
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This is manufactured by Microchip Technology. The manufacturer part number is MCP6N11T-100E/MNY. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. The product has -40°c ~ 125°c operating temperature range. Moreover, the product comes in 8-wfdfn exposed pad. The typical current - input bias includes 10 pa. The input offset voltage is 350 µv. The maximum voltage supply span of the product is 5.5 v. While the minimum voltage supply is 1.8 v. In addition, it is reach unaffected. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 800µa. It is shipped in tape & reel (tr) package . Its typical moisture sensitivity level is 1 (unlimited). The 6v/µs is the slew rate of the product. It has a long 6 weeks standard lead time. It integrates 1 circuits. The gain bandwidth product is 35 mhz. The product is available in surface mount configuration. 8-tdfn (2x3) is the supplier device package value. It is a sort of a instrumentation amplifier. Moreover, it corresponds to mcp6n11, a base product number of the product. The product is designated with the ear99 code number.

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Microchip CA Prop65(Environmental Information)
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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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Assembly Site 22/Nov/2023(PCN Assembly/Origin)
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8L TDFN Package 09/Oct/2016(PCN Design/Specification)
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Mold Compound Update 18/Feb/2015(PCN Design/Specification)
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CuPdAu Bond Wire 24/Apr/2015(PCN Other)
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MCP6N11(Datasheets)
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Packing Changes 10/Oct/2016(PCN Packaging)
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Label and Packing Changes 23/Sep/2015(PCN Packaging)

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FAQs

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