Texas Instruments TLV2451IP

TLV2451IP Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Current - Output / Channel:
10 mA
Operating Temperature:
-40°C ~ 125°C
Package / Case:
8-DIP (0.300", 7.62mm)
Current - Input Bias:
500 pA
Voltage - Input Offset:
300 µV
Voltage - Supply Span (Max):
6 V
title:
TLV2451IP
Voltage - Supply Span (Min):
2.7 V
REACH Status:
REACH Unaffected
Output Type:
Rail-to-Rail
edacadModel:
TLV2451IP Models
Current - Supply:
23µA
edacadModelUrl:
/en/models/277536
Moisture Sensitivity Level (MSL):
Not Applicable
Slew Rate:
0.11V/µs
standardLeadTime:
6 Weeks
Number of Circuits:
1
Gain Bandwidth Product:
220 kHz
Mounting Type:
Through Hole
Series:
-
Supplier Device Package:
8-PDIP
Packaging:
Tube
Amplifier Type:
General Purpose
Base Product Number:
TLV2451
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is TLV2451IP. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. It carries 10 ma output or channel current. The product has -40°c ~ 125°c operating temperature range. Moreover, the product comes in 8-dip (0.300", 7.62mm). The typical current - input bias includes 500 pa. The input offset voltage is 300 µv. The maximum voltage supply span of the product is 6 v. While the minimum voltage supply is 2.7 v. In addition, it is reach unaffected. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 23µa. Its typical moisture sensitivity level is not applicable. The 0.11v/µs is the slew rate of the product. It has a long 6 weeks standard lead time. It integrates 1 circuits. The gain bandwidth product is 220 khz. The product is available in through hole configuration. 8-pdip is the supplier device package value. In addition, tube is the available packaging type of the product. It is a sort of a general purpose amplifier. Moreover, it corresponds to tlv2451, a base product number of the product. The product is designated with the ear99 code number.

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Mult Dev Assembly/Wafer Site 08/Feb/2024(PCN Assembly/Origin)
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TLV2450-55, TLV245xA(Datasheets)
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Material Set 30/Mar/2017(PCN Design/Specification)

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