Texas Instruments LT1014DDWR

LT1014DDWR Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Current - Output / Channel:
25 mA
Operating Temperature:
0°C ~ 70°C
Package / Case:
16-SOIC (0.295", 7.50mm Width)
Current - Input Bias:
12 nA
Voltage - Input Offset:
60 µV
Voltage - Supply Span (Max):
30 V
title:
LT1014DDWR
Voltage - Supply Span (Min):
4 V
REACH Status:
REACH Unaffected
Output Type:
-
edacadModel:
LT1014DDWR Models
Current - Supply:
350µA (x4 Channels)
edacadModelUrl:
/en/models/1510917
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Slew Rate:
0.4V/µs
standardLeadTime:
6 Weeks
Number of Circuits:
4
Gain Bandwidth Product:
1 MHz
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
16-SOIC
Packaging:
Tape & Reel (TR)
Amplifier Type:
General Purpose
Base Product Number:
LT1014
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LT1014DDWR. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. It carries 25 ma output or channel current. The product has 0°c ~ 70°c operating temperature range. Moreover, the product comes in 16-soic (0.295", 7.50mm width). The typical current - input bias includes 12 na. The input offset voltage is 60 µv. The maximum voltage supply span of the product is 30 v. While the minimum voltage supply is 4 v. In addition, it is reach unaffected. The current - supply of a bespoke product is 350µa (x4 channels). Its typical moisture sensitivity level is 1 (unlimited). The 0.4v/µs is the slew rate of the product. It has a long 6 weeks standard lead time. It integrates 4 circuits. The gain bandwidth product is 1 mhz. The product is available in surface mount configuration. 16-soic is the supplier device package value. In addition, tape & reel (tr) is the available packaging type of the product. It is a sort of a general purpose amplifier. Moreover, it corresponds to lt1014, a base product number of the product. The product is designated with the ear99 code number.

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Mult Dev Assembly/Wafer Site 13/Jun/2024(PCN Assembly/Origin)
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Material Set Rev 24/Jan/2016(PCN Design/Specification)

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