Texas Instruments LF444CMX/NOPB

LF444CMX-NOPB Texas Instruments LF444CMX/NOPB
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Current - Output / Channel:
14 mA
Operating Temperature:
0°C ~ 70°C
Package / Case:
14-SOIC (0.154", 3.90mm Width)
Current - Input Bias:
10 pA
Voltage - Input Offset:
3 mV
Voltage - Supply Span (Max):
36 V
Voltage - Supply Span (Min):
36 V
REACH Status:
REACH Unaffected
Output Type:
-
edacadModel:
LF444CMX/NOPB Models
Current - Supply:
600µA (x4 Channels)
edacadModelUrl:
/en/models/366703
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Slew Rate:
1V/µs
standardLeadTime:
12 Weeks
Number of Circuits:
4
Gain Bandwidth Product:
1 MHz
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
14-SOIC
Packaging:
Tape & Reel (TR)
Amplifier Type:
J-FET
Base Product Number:
LF444
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LF444CMX/NOPB. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. It carries 14 ma output or channel current. The product has 0°c ~ 70°c operating temperature range. Moreover, the product comes in 14-soic (0.154", 3.90mm width). The typical current - input bias includes 10 pa. The input offset voltage is 3 mv. The maximum voltage supply span of the product is 36 v. While the minimum voltage supply is 36 v. In addition, it is reach unaffected. The current - supply of a bespoke product is 600µa (x4 channels). Its typical moisture sensitivity level is 1 (unlimited). The 1v/µs is the slew rate of the product. It has a long 12 weeks standard lead time. It integrates 4 circuits. The gain bandwidth product is 1 mhz. The product is available in surface mount configuration. 14-soic is the supplier device package value. In addition, tape & reel (tr) is the available packaging type of the product. It is a sort of a j-fet amplifier. Moreover, it corresponds to lf444, a base product number of the product. The product is designated with the ear99 code number.

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Wafer Fab 25/Sep/2018(PCN Assembly/Origin)
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Mult Dev Packaging 23/May/2024(PCN Packaging)

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