Texas Instruments LPC662AIMX/NOPB

LPC662AIMX-NOPB Texas Instruments LPC662AIMX/NOPB
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Current - Output / Channel:
40 mA
Operating Temperature:
-40°C ~ 85°C (TJ)
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Current - Input Bias:
0.002 pA
Voltage - Supply Span (Max):
15.5 V
edacadModel:
LPC662AIMX/NOPB Models
Voltage - Supply Span (Min):
4.75 V
REACH Status:
REACH Unaffected
Output Type:
Push-Pull, Rail-to-Rail
Current - Supply:
86µA (x2 Channels)
edacadModelUrl:
/en/models/367790
Package:
Tape & Reel (TR)
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Slew Rate:
0.11V/µs
Voltage - Input Offset:
1 mV
Number of Circuits:
2
Gain Bandwidth Product:
350 kHz
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIC
Amplifier Type:
CMOS
Base Product Number:
LPC662
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LPC662AIMX/NOPB. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. It carries 40 ma output or channel current. The product has -40°c ~ 85°c (tj) operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). The typical current - input bias includes 0.002 pa. The maximum voltage supply span of the product is 15.5 v. While the minimum voltage supply is 4.75 v. In addition, it is reach unaffected. Furthermore, it has apush-pull, rail-to-rail output. The current - supply of a bespoke product is 86µa (x2 channels). It is shipped in tape & reel (tr) package . Its typical moisture sensitivity level is 1 (unlimited). The 0.11v/µs is the slew rate of the product. The input offset voltage is 1 mv. It integrates 2 circuits. The gain bandwidth product is 350 khz. The product is available in surface mount configuration. 8-soic is the supplier device package value. It is a sort of a cmos amplifier. Moreover, it corresponds to lpc662, a base product number of the product. The product is designated with the ear99 code number.

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Mult Devices Wafer Fab Site 09/Mar/2017(PCN Assembly/Origin)
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Mold Compound 24/Mar/2016(PCN Design/Specification)
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Mult Dev EOL 7/Sep/2023(PCN Obsolescence/ EOL)

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