Microchip Technology MCP6N11T-001E/MNY

MCP6N11T-001E-MNY Microchip Technology MCP6N11T-001E/MNY
Microchip Technology

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Operating Temperature:
-40°C ~ 125°C
Package / Case:
8-WFDFN Exposed Pad
Current - Input Bias:
10 pA
Voltage - Input Offset:
3 mV
Voltage - Supply Span (Max):
5.5 V
Voltage - Supply Span (Min):
1.8 V
REACH Status:
REACH Unaffected
Output Type:
Rail-to-Rail
edacadModel:
MCP6N11T-001E/MNY Models
Current - Supply:
800µA
edacadModelUrl:
/en/models/2775779
Package:
Tape & Reel (TR)
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Slew Rate:
9V/µs
standardLeadTime:
6 Weeks
Number of Circuits:
1
Gain Bandwidth Product:
500 kHz
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-TDFN (2x3)
Amplifier Type:
Instrumentation
Base Product Number:
MCP6N11
ECCN:
EAR99
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This is manufactured by Microchip Technology. The manufacturer part number is MCP6N11T-001E/MNY. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. The product has -40°c ~ 125°c operating temperature range. Moreover, the product comes in 8-wfdfn exposed pad. The typical current - input bias includes 10 pa. The input offset voltage is 3 mv. The maximum voltage supply span of the product is 5.5 v. While the minimum voltage supply is 1.8 v. In addition, it is reach unaffected. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 800µa. It is shipped in tape & reel (tr) package . Its typical moisture sensitivity level is 1 (unlimited). The 9v/µs is the slew rate of the product. It has a long 6 weeks standard lead time. It integrates 1 circuits. The gain bandwidth product is 500 khz. The product is available in surface mount configuration. 8-tdfn (2x3) is the supplier device package value. It is a sort of a instrumentation amplifier. Moreover, it corresponds to mcp6n11, a base product number of the product. The product is designated with the ear99 code number.

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Microchip CA Prop65(Environmental Information)
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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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Assembly Site 22/Nov/2023(PCN Assembly/Origin)
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8L TDFN Package 09/Oct/2016(PCN Design/Specification)
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Mold Compound Update 18/Feb/2015(PCN Design/Specification)
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CuPdAu Bond Wire 24/Apr/2015(PCN Other)
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MCP6N11(Datasheets)
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Packing Changes 10/Oct/2016(PCN Packaging)
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Label and Packing Changes 23/Sep/2015(PCN Packaging)

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FAQs

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