Texas Instruments TLV2472IP

TLV2472IP Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Current - Output / Channel:
35 mA
Operating Temperature:
-40°C ~ 125°C (TA)
Package / Case:
8-DIP (0.300", 7.62mm)
Current - Input Bias:
2.5 pA
Voltage - Input Offset:
250 µV
Voltage - Supply Span (Max):
6 V
Voltage - Supply Span (Min):
2.7 V
REACH Status:
REACH Unaffected
Output Type:
Rail-to-Rail
edacadModel:
TLV2472IP Models
Current - Supply:
600µA (x2 Channels)
edacadModelUrl:
/en/models/380865
Moisture Sensitivity Level (MSL):
Not Applicable
Slew Rate:
1.5V/µs
standardLeadTime:
6 Weeks
Number of Circuits:
2
Gain Bandwidth Product:
2.8 MHz
Mounting Type:
Through Hole
Series:
-
Supplier Device Package:
8-PDIP
Packaging:
Tube
Amplifier Type:
CMOS
Base Product Number:
TLV2472
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is TLV2472IP. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. It carries 35 ma output or channel current. The product has -40°c ~ 125°c (ta) operating temperature range. Moreover, the product comes in 8-dip (0.300", 7.62mm). The typical current - input bias includes 2.5 pa. The input offset voltage is 250 µv. The maximum voltage supply span of the product is 6 v. While the minimum voltage supply is 2.7 v. In addition, it is reach unaffected. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 600µa (x2 channels). Its typical moisture sensitivity level is not applicable. The 1.5v/µs is the slew rate of the product. It has a long 6 weeks standard lead time. It integrates 2 circuits. The gain bandwidth product is 2.8 mhz. The product is available in through hole configuration. 8-pdip is the supplier device package value. In addition, tube is the available packaging type of the product. It is a sort of a cmos amplifier. Moreover, it corresponds to tlv2472, a base product number of the product. The product is designated with the ear99 code number.

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Mult Dev Assembly/Wafer Site 08/Feb/2024(PCN Assembly/Origin)
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TLV2470-75, TLV247xA(Datasheets)
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Material Set 30/Mar/2017(PCN Design/Specification)

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