Texas Instruments TL972IP

TL972IP Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Current - Output / Channel:
80 mA
Operating Temperature:
-40°C ~ 125°C
Package / Case:
8-DIP (0.300", 7.62mm)
Current - Input Bias:
200 nA
Voltage - Input Offset:
1 mV
Voltage - Supply Span (Max):
12 V
Voltage - Supply Span (Min):
2.7 V
REACH Status:
REACH Unaffected
Output Type:
Rail-to-Rail
edacadModel:
TL972IP Models
Current - Supply:
2mA (x2 Channels)
edacadModelUrl:
/en/models/1906129
Package:
Tube
Moisture Sensitivity Level (MSL):
Not Applicable
Slew Rate:
5V/µs
standardLeadTime:
6 Weeks
Number of Circuits:
2
Gain Bandwidth Product:
12 MHz
Mounting Type:
Through Hole
Series:
-
Supplier Device Package:
8-PDIP
Amplifier Type:
General Purpose
Base Product Number:
TL972
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is TL972IP. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. It carries 80 ma output or channel current. The product has -40°c ~ 125°c operating temperature range. Moreover, the product comes in 8-dip (0.300", 7.62mm). The typical current - input bias includes 200 na. The input offset voltage is 1 mv. The maximum voltage supply span of the product is 12 v. While the minimum voltage supply is 2.7 v. In addition, it is reach unaffected. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 2ma (x2 channels). It is shipped in tube package . Its typical moisture sensitivity level is not applicable. The 5v/µs is the slew rate of the product. It has a long 6 weeks standard lead time. It integrates 2 circuits. The gain bandwidth product is 12 mhz. The product is available in through hole configuration. 8-pdip is the supplier device package value. It is a sort of a general purpose amplifier. Moreover, it corresponds to tl972, a base product number of the product. The product is designated with the ear99 code number.

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Material Set 30/Mar/2017(PCN Design/Specification)
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Mult Dev Assembly Wafer Fab Site/Design 22/Dec/2023(PCN Design/Specification)

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