Texas Instruments LMV824MTX/NOPB

LMV824MTX-NOPB Texas Instruments LMV824MTX/NOPB
Texas Instruments

Product Information

Manufacturer Standard Lead Time:
26 Weeks
Detailed Description:
General Purpose Amplifier 4 Circuit Rail-to-Rail 14-TSSOP
Operating Temperature:
-40°C ~ 85°C
Voltage - Supply, Single/Dual (±):
2.5V ~ 5.5V, ±1.25V ~ 2.75V
Package / Case:
14-TSSOP (0.173", 4.40mm Width)
Current - Input Bias:
40nA
Base Part Number:
LMV824
Output Type:
Rail-to-Rail
Current - Supply:
1mA (x4 Channels)
Manufacturer:
Texas Instruments
Current - Output / Channel:
45mA
Voltage - Input Offset:
1mV
Number of Circuits:
4
Gain Bandwidth Product:
5.6MHz
Mounting Type:
Surface Mount
Series:
Automotive, AEC-Q100, LMV®
Supplier Device Package:
14-TSSOP
Packaging:
Cut Tape (CT)
Customer Reference:
Slew Rate:
2V/µs
Amplifier Type:
General Purpose
Checking for live stock

This is manufactured by Texas Instruments. The manufacturer part number is LMV824MTX/NOPB. It has typical 26 weeks of manufacturer standard lead time. It features general purpose amplifier 4 circuit rail-to-rail 14-tssop. The product has -40°c ~ 85°c operating temperature range. It features a typical 2.5v ~ 5.5v, ±1.25v ~ 2.75v voltage of single or dual. Moreover, the product comes in 14-tssop (0.173", 4.40mm width). The typical current - input bias includes 40na. Base Part Number: lmv824. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 1ma (x4 channels). The texas instruments's product offers user-desired applications. It carries 45ma output or channel current. The input offset voltage is 1mv. It integrates 4 circuits. The gain bandwidth product is 5.6mhz. The product is available in surface mount configuration. The product automotive, aec-q100, lmv®, is a highly preferred choice for users. 14-tssop is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The 2v/µs is the slew rate of the product. It is a sort of a general purpose amplifier.

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Mult Devices Rev 13/Mar/2018(PCN Assembly/Origin)
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Copper Base Metal 16/Mar/2015(PCN Design/Specification)
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Qualification TSSOP Devices 27/Sep/2013(PCN Design/Specification)
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Packing Material Revision A 19/May/2015(PCN Packaging)
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Pack Material Update 11/May/2015(PCN Packaging)

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