Texas Instruments TLV2171IDR

TLV2171IDR Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Current - Output / Channel:
25 mA
Operating Temperature:
-40°C ~ 125°C
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Current - Input Bias:
10 pA
Voltage - Input Offset:
750 µV
Voltage - Supply Span (Max):
36 V
Voltage - Supply Span (Min):
2.7 V
REACH Status:
REACH Unaffected
Output Type:
Rail-to-Rail
edacadModel:
TLV2171IDR Models
Current - Supply:
525µA (x2 Channels)
edacadModelUrl:
/en/models/6205549
Package:
Tape & Reel (TR)
Moisture Sensitivity Level (MSL):
2 (1 Year)
Slew Rate:
1.5V/µs
standardLeadTime:
6 Weeks
Number of Circuits:
2
Gain Bandwidth Product:
3 MHz
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIC
Amplifier Type:
General Purpose
Base Product Number:
TLV2171
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is TLV2171IDR. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. It carries 25 ma output or channel current. The product has -40°c ~ 125°c operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). The typical current - input bias includes 10 pa. The input offset voltage is 750 µv. The maximum voltage supply span of the product is 36 v. While the minimum voltage supply is 2.7 v. In addition, it is reach unaffected. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 525µa (x2 channels). It is shipped in tape & reel (tr) package . Its typical moisture sensitivity level is 2 (1 year). The 1.5v/µs is the slew rate of the product. It has a long 6 weeks standard lead time. It integrates 2 circuits. The gain bandwidth product is 3 mhz. The product is available in surface mount configuration. 8-soic is the supplier device package value. It is a sort of a general purpose amplifier. Moreover, it corresponds to tlv2171, a base product number of the product. The product is designated with the ear99 code number.

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Wafer Fab Site 16/Dec/2022(PCN Assembly/Origin)
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Design 25/Feb/2022(PCN Design/Specification)

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