Microchip Technology MCP23S08T-E/ML

MCP23S08T-E-ML Microchip Technology MCP23S08T-E/ML
Microchip Technology

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
DigiKey Programmable:
Not Verified
Interrupt Output:
Yes
Operating Temperature:
-40°C ~ 125°C
Package / Case:
20-VFQFN Exposed Pad
REACH Status:
REACH Unaffected
Output Type:
Push-Pull
edacadModel:
MCP23S08T-E/ML Models
Interface:
SPI
Package:
Tape & Reel (TR)
Moisture Sensitivity Level (MSL):
1 (Unlimited)
edacadModelUrl:
/en/models/1223122
Clock Frequency:
10 MHz
Number of I/O:
8
standardLeadTime:
4 Weeks
Current - Output Source/Sink:
25mA
Features:
POR
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
20-QFN (4x4)
Voltage - Supply:
1.8V ~ 5.5V
Base Product Number:
MCP23S08
ECCN:
EAR99
Checking for live stock

This is manufactured by Microchip Technology. The manufacturer part number is MCP23S08T-E/ML. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. Interrupt output Options - yes. The product has -40°c ~ 125°c operating temperature range. Moreover, the product comes in 20-vfqfn exposed pad. In addition, it is reach unaffected. Furthermore, it has apush-pull output. A bespoke product is spi interface. It is shipped in tape & reel (tr) package . Its typical moisture sensitivity level is 1 (unlimited). The product boasts a clock frequency of 10 mhz. 8 is the I/O value of the product. It has a long 4 weeks standard lead time. The current of output source/sink is 25ma. The splendid features of the product include por. The product is available in surface mount configuration. 20-qfn (4x4) is the supplier device package value. It has optimum voltage supply of 1.8v ~ 5.5v. Moreover, it corresponds to mcp23s08, a base product number of the product. The product is designated with the ear99 code number.

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Microchip CA Prop65(Environmental Information)
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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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Qualification QFN-28,20,16 Packages 26/Dec/2013(PCN Assembly/Origin)
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Development Tools Catalog(Manuals)
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MCP23008/MCP23S08 06/Jul/2022(PCN Design/Specification)
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LeadFrame/Bond Wire Material Update 31/Aug/2017(PCN Design/Specification)
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MCP23008, MCP23S08(Datasheets)
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Packing Changes 10/Oct/2016(PCN Packaging)
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Label and Packing Changes 23/Sep/2015(PCN Packaging)

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