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The Fischer Elektronik LAM 5 75 12 is a highly efficient heatsink designed to dissipate heat generated by electronic components, specifically those with TO-218, TO-220, TO-247, TO-264, and similar packages. This compact and versatile heatsink is known for its excellent thermal performance, making it an ideal choice for cooling semiconductor devices in various applications. Its compatibility with different package types, efficient thermal performance, compact dimensions, PCB mounting capability, and robust construction make it an excellent choice for cooling electronic components in various applications, enhancing their reliability and longevity.
One of the standout features of the LAM 5 75 12 heatsink is its compatibility with a range of semiconductor packages, including TO-218, TO-220, TO-247, TO-264, and more.
The primary function of the LAM 5 75 12 is to dissipate heat efficiently from electronic components. With a thermal resistance of 0.8°C/W (0.8K/W), it can quickly transfer heat away from the device it is cooling, preventing overheating and ensuring the reliable operation of electronic components.
The heatsink is designed for easy PCB (Printed Circuit Board) mounting. This feature simplifies installation and ensures a secure and stable attachment to the circuit board.
It is constructed using durable materials that can handle the rigours of electronic applications, ensuring long-term reliability.
The LAM 5 75 12 heatsink finds applications in a broad spectrum of electronic systems, including:
For more information please check the datasheets.
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