NXP USA Inc. 74ABT32N,112

74ABT32N-112 NXP USA Inc. 74ABT32N,112
74ABT32N,112
NXP USA Inc.

Product Information

Number of Inputs:
2
HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Current - Quiescent (Max):
50 µA
Operating Temperature:
-40°C ~ 85°C
Package / Case:
14-DIP (0.300", 7.62mm)
Input Logic Level - Low:
0.8V
Input Logic Level - High:
2V
REACH Status:
REACH Unaffected
Max Propagation Delay @ V, Max CL:
3.4ns @ 5V, 50pF
Package:
Tube
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Number of Circuits:
4
Features:
-
Mounting Type:
Through Hole
Series:
74ABT
Logic Type:
OR Gate
Supplier Device Package:
14-DIP
Voltage - Supply:
4.5V ~ 5.5V
Current - Output High, Low:
15mA, 20mA
Base Product Number:
74ABT32
ECCN:
EAR99
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This is manufactured by NXP USA Inc.. The manufacturer part number is 74ABT32N,112. The product consists of 2 inputs. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. It has a maximum quiescent current of 50 µa. The product has -40°c ~ 85°c operating temperature range. Moreover, the product comes in 14-dip (0.300", 7.62mm). Product with 0.8v input logic level - low. Features input logic level - high of 2v. In addition, it is reach unaffected. The maximum propagation delay at given voltage includes 3.4ns @ 5v, 50pf. It is shipped in tube package . Its typical moisture sensitivity level is 1 (unlimited). It integrates 4 circuits. The product is available in through hole configuration. The product 74abt, is a highly preferred choice for users. The product is a or gate logic type. 14-dip is the supplier device package value. It has optimum voltage supply of 4.5v ~ 5.5v. The high and low output current of the product is 15ma, 20ma. Moreover, it corresponds to 74abt32, a base product number of the product. The product is designated with the ear99 code number.

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Multiple Devices 29/Dec/2014(PCN Obsolescence/ EOL)
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74ABT32(Datasheets)
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NXP USA Inc REACH(Environmental Information)
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NXP USA Inc RoHS Cert(Environmental Information)
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All Dev Label Update 15/Dec/2020(PCN Packaging)

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