AMD Xilinx XCVU27P-3FSGA2577E

AMD Xilinx

Product Information

Mounting Type:
Surface Mount
HTSUS:
8542.39.0001
Package:
Tray
Series:
Virtex® UltraScale+™
Operating Temperature:
0°C ~ 100°C (TJ)
Number of LABs/CLBs:
162000
Supplier Device Package:
2577-FCBGA (52.5x52.5)
Total RAM Bits:
74344038
Number of I/O:
448
Voltage - Supply:
0.825V ~ 0.876V
Number of Logic Elements/Cells:
2835000
Package / Case:
2577-BBGA, FCBGA
standardLeadTime:
52 Weeks
ECCN:
3A001A7B
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This is manufactured by AMD Xilinx. The manufacturer part number is XCVU27P-3FSGA2577E. The product is available in surface mount configuration. It is assigned with possible HTSUS value of 8542.39.0001. It is shipped in tray package . The product virtex® ultrascale+™, is a highly preferred choice for users. The product has 0°c ~ 100°c (tj) operating temperature range. It consists of 162000 CLBs/LABs. 2577-fcbga (52.5x52.5) is the supplier device package value. It include a total of 74344038 RAM bits. 448 is the I/O value of the product. It has optimum voltage supply of 0.825v ~ 0.876v. The product contains 2835000 logic cells/elements. Moreover, the product comes in 2577-bbga, fcbga. It has a long 52 weeks standard lead time. The product is designated with the 3a001a7b code number.

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Xilinx REACH211 Cert(Environmental Information)

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