AMD Xilinx XCKU3P-2FFVD900I

XCKU3P-2FFVD900I AMD Xilinx
AMD Xilinx

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Number of I/O:
304
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Total RAM Bits:
31641600
Number of Logic Elements/Cells:
355950
Package:
Tray
Moisture Sensitivity Level (MSL):
4 (72 Hours)
standardLeadTime:
35 Weeks
Number of LABs/CLBs:
20340
Mounting Type:
Surface Mount
Series:
Kintex® UltraScale+™
Supplier Device Package:
900-FCBGA (31x31)
Voltage - Supply:
0.825V ~ 0.876V
Base Product Number:
XCKU3
ECCN:
3A991D
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This is manufactured by AMD Xilinx. The manufacturer part number is XCKU3P-2FFVD900I. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. 304 is the I/O value of the product. The product has -40°c ~ 100°c (tj) operating temperature range. Moreover, the product comes in 900-bbga, fcbga. It include a total of 31641600 RAM bits. The product contains 355950 logic cells/elements. It is shipped in tray package . Its typical moisture sensitivity level is 4 (72 hours). It has a long 35 weeks standard lead time. It consists of 20340 CLBs/LABs. The product is available in surface mount configuration. The product kintex® ultrascale+™, is a highly preferred choice for users. 900-fcbga (31x31) is the supplier device package value. It has optimum voltage supply of 0.825v ~ 0.876v. Moreover, it corresponds to xcku3, a base product number of the product. The product is designated with the 3a991d code number.

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Xilinx REACH211 Cert(Environmental Information)

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