AMD Xilinx XCKU115-3FLVB1760E

AMD Xilinx

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Number of I/O:
702
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Total RAM Bits:
77721600
Number of Logic Elements/Cells:
1451100
REACH Status:
REACH Unaffected
Package:
Bulk
Moisture Sensitivity Level (MSL):
4 (72 Hours)
standardLeadTime:
48 Weeks
Number of LABs/CLBs:
82920
Mounting Type:
Surface Mount
Series:
Kintex® UltraScale™
Supplier Device Package:
1760-FCBGA (42.5x42.5)
Voltage - Supply:
0.970V ~ 1.030V
Base Product Number:
XCKU115
ECCN:
3A001A7B
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This is manufactured by AMD Xilinx. The manufacturer part number is XCKU115-3FLVB1760E. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. 702 is the I/O value of the product. The product has 0°c ~ 100°c (tj) operating temperature range. Moreover, the product comes in 1760-bbga, fcbga. It include a total of 77721600 RAM bits. The product contains 1451100 logic cells/elements. In addition, it is reach unaffected. It is shipped in bulk package . Its typical moisture sensitivity level is 4 (72 hours). It has a long 48 weeks standard lead time. It consists of 82920 CLBs/LABs. The product is available in surface mount configuration. The product kintex® ultrascale™, is a highly preferred choice for users. 1760-fcbga (42.5x42.5) is the supplier device package value. It has optimum voltage supply of 0.970v ~ 1.030v. Moreover, it corresponds to xcku115, a base product number of the product. The product is designated with the 3a001a7b code number.

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Wireless Bluetooth® Low Energy Modules Overview(Datasheets)
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Ultrascale & Virtex Dev Spec Chg 20/Dec/2016(PCN Design/Specification)
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Xilinx REACH211 Cert(Environmental Information)

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