AMD Xilinx XCKU035-2FBVA676I

XCKU035-2FBVA676I AMD Xilinx
AMD Xilinx

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Number of I/O:
312
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Total RAM Bits:
19456000
Number of Logic Elements/Cells:
444343
REACH Status:
REACH Unaffected
Package:
Bulk
Moisture Sensitivity Level (MSL):
4 (72 Hours)
standardLeadTime:
44 Weeks
Number of LABs/CLBs:
25391
Mounting Type:
Surface Mount
Series:
Kintex® UltraScale™
Supplier Device Package:
676-FCBGA (27x27)
Voltage - Supply:
0.922V ~ 0.979V
Base Product Number:
XCKU035
ECCN:
3A991D
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This is manufactured by AMD Xilinx. The manufacturer part number is XCKU035-2FBVA676I. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. 312 is the I/O value of the product. The product has -40°c ~ 100°c (tj) operating temperature range. Moreover, the product comes in 676-bbga, fcbga. It include a total of 19456000 RAM bits. The product contains 444343 logic cells/elements. In addition, it is reach unaffected. It is shipped in bulk package . Its typical moisture sensitivity level is 4 (72 hours). It has a long 44 weeks standard lead time. It consists of 25391 CLBs/LABs. The product is available in surface mount configuration. The product kintex® ultrascale™, is a highly preferred choice for users. 676-fcbga (27x27) is the supplier device package value. It has optimum voltage supply of 0.922v ~ 0.979v. Moreover, it corresponds to xcku035, a base product number of the product. The product is designated with the 3a991d code number.

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Wireless Bluetooth® Low Energy Modules Overview(Datasheets)
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Ultrascale & Virtex Dev Spec Chg 20/Dec/2016(PCN Design/Specification)
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Xilinx REACH211 Cert(Environmental Information)

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