AMD Xilinx XC3SD3400A-5FGG676C

XC3SD3400A-5FGG676C AMD Xilinx
XC3SD3400A-5FGG676C
AMD Xilinx

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Number of I/O:
469
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
Total RAM Bits:
2322432
Number of Logic Elements/Cells:
53712
REACH Status:
REACH Unaffected
Package:
Tray
Moisture Sensitivity Level (MSL):
3 (168 Hours)
standardLeadTime:
30 Weeks
Number of LABs/CLBs:
5968
Mounting Type:
Surface Mount
Number of Gates:
3400000
Series:
Spartan®-3A DSP
Supplier Device Package:
676-FBGA (27x27)
Voltage - Supply:
1.14V ~ 1.26V
Base Product Number:
XC3SD3400
ECCN:
3A991D
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This is manufactured by AMD Xilinx. The manufacturer part number is XC3SD3400A-5FGG676C. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. 469 is the I/O value of the product. The product has 0°c ~ 85°c (tj) operating temperature range. Moreover, the product comes in 676-bga. It include a total of 2322432 RAM bits. The product contains 53712 logic cells/elements. In addition, it is reach unaffected. It is shipped in tray package . Its typical moisture sensitivity level is 3 (168 hours). It has a long 30 weeks standard lead time. It consists of 5968 CLBs/LABs. The product is available in surface mount configuration. It contains 3400000 gates. The product spartan®-3a dsp, is a highly preferred choice for users. 676-fbga (27x27) is the supplier device package value. It has optimum voltage supply of 1.14v ~ 1.26v. Moreover, it corresponds to xc3sd3400, a base product number of the product. The product is designated with the 3a991d code number.

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Copper Wire Bond Material 09/Dec/2013(PCN Design/Specification)
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Xilinx REACH211 Cert(Environmental Information)

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