AMD Xilinx XC3S2000-4FGG900C

XC3S2000-4FGG900C AMD Xilinx
AMD Xilinx

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Number of I/O:
565
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
900-BBGA
Total RAM Bits:
737280
Number of Logic Elements/Cells:
46080
REACH Status:
REACH Unaffected
Package:
Tray
Moisture Sensitivity Level (MSL):
3 (168 Hours)
standardLeadTime:
20 Weeks
Number of LABs/CLBs:
5120
Mounting Type:
Surface Mount
Number of Gates:
2000000
Series:
Spartan®-3
Supplier Device Package:
900-FBGA (31x31)
Voltage - Supply:
1.14V ~ 1.26V
Base Product Number:
XC3S2000
ECCN:
3A001A7A
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This is manufactured by AMD Xilinx. The manufacturer part number is XC3S2000-4FGG900C. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. 565 is the I/O value of the product. The product has 0°c ~ 85°c (tj) operating temperature range. Moreover, the product comes in 900-bbga. It include a total of 737280 RAM bits. The product contains 46080 logic cells/elements. In addition, it is reach unaffected. It is shipped in tray package . Its typical moisture sensitivity level is 3 (168 hours). It has a long 20 weeks standard lead time. It consists of 5120 CLBs/LABs. The product is available in surface mount configuration. It contains 2000000 gates. The product spartan®-3, is a highly preferred choice for users. 900-fbga (31x31) is the supplier device package value. It has optimum voltage supply of 1.14v ~ 1.26v. Moreover, it corresponds to xc3s2000, a base product number of the product. The product is designated with the 3a001a7a code number.

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Xilinx REACH211 Cert(Environmental Information)

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