AMD Xilinx XCVU23P-L2FSVJ1760E

XCVU23P-L2FSVJ1760E AMD Xilinx
AMD Xilinx

Product Information

HTSUS:
8542.39.0001
Number of I/O:
644
Operating Temperature:
0°C ~ 110°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Total RAM Bits:
77909197
Number of Logic Elements/Cells:
2252250
Package:
Tray
Moisture Sensitivity Level (MSL):
4 (72 Hours)
standardLeadTime:
35 Weeks
Number of LABs/CLBs:
128700
Mounting Type:
Surface Mount
Series:
Virtex® UltraScale+™
Supplier Device Package:
1760-FCBGA (42.5x42.5)
Voltage - Supply:
0.698V ~ 0.742V
ECCN:
3A001A7B
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This is manufactured by AMD Xilinx. The manufacturer part number is XCVU23P-L2FSVJ1760E. It is assigned with possible HTSUS value of 8542.39.0001. 644 is the I/O value of the product. The product has 0°c ~ 110°c (tj) operating temperature range. Moreover, the product comes in 1760-bbga, fcbga. It include a total of 77909197 RAM bits. The product contains 2252250 logic cells/elements. It is shipped in tray package . Its typical moisture sensitivity level is 4 (72 hours). It has a long 35 weeks standard lead time. It consists of 128700 CLBs/LABs. The product is available in surface mount configuration. The product virtex® ultrascale+™, is a highly preferred choice for users. 1760-fcbga (42.5x42.5) is the supplier device package value. It has optimum voltage supply of 0.698v ~ 0.742v. The product is designated with the 3a001a7b code number.

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