AMD Xilinx XC7K325T-1FFG900C

XC7K325T-1FFG900C AMD Xilinx
AMD Xilinx

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Number of I/O:
500
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
900-BBGA, FCBGA
Total RAM Bits:
16404480
Number of Logic Elements/Cells:
326080
REACH Status:
REACH Unaffected
Package:
Tray
Moisture Sensitivity Level (MSL):
4 (72 Hours)
standardLeadTime:
48 Weeks
Number of LABs/CLBs:
25475
Mounting Type:
Surface Mount
Series:
Kintex®-7
Supplier Device Package:
900-FCBGA (31x31)
Voltage - Supply:
0.97V ~ 1.03V
Base Product Number:
XC7K325
ECCN:
3A991D
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This is manufactured by AMD Xilinx. The manufacturer part number is XC7K325T-1FFG900C. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. 500 is the I/O value of the product. The product has 0°c ~ 85°c (tj) operating temperature range. Moreover, the product comes in 900-bbga, fcbga. It include a total of 16404480 RAM bits. The product contains 326080 logic cells/elements. In addition, it is reach unaffected. It is shipped in tray package . Its typical moisture sensitivity level is 4 (72 hours). It has a long 48 weeks standard lead time. It consists of 25475 CLBs/LABs. The product is available in surface mount configuration. The product kintex®-7, is a highly preferred choice for users. 900-fcbga (31x31) is the supplier device package value. It has optimum voltage supply of 0.97v ~ 1.03v. Moreover, it corresponds to xc7k325, a base product number of the product. The product is designated with the 3a991d code number.

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Xilinx REACH211 Cert(Environmental Information)
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Mult Dev Material Chg 16/Dec/2019(PCN Design/Specification)
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Product Marking Chg 31/Oct/2016(PCN Design/Specification)
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Mult Devices 26/Jun/2017(PCN Packaging)
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Kintex-7 FPGAs CES9937 Errata(Errata)

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