AMD Xilinx XC3S1000-4FGG676C

Enrgtech Part No: ET22841505
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Manufacturer Part No:
XC3S1000-4FGG676C
|
Manufacturer: AMD Xilinx

Product Information

HTSUS:

8542.39.0001

RoHS Status:

ROHS3 Compliant

Number of I/O:

391

Operating Temperature:

0°C ~ 85°C (TJ)

Package / Case:

676-BGA

Total RAM Bits:

442368

Number of Logic Elements/Cells:

17280

REACH Status:

REACH Unaffected

Package:

Tray

Moisture Sensitivity Level (MSL):

3 (168 Hours)

standardLeadTime:

20 Weeks

Number of LABs/CLBs:

1920

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This is manufactured by AMD Xilinx. The manufacturer part number is XC3S1000-4FGG676C. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. 391 is the I/O value of the product. The product has 0°c ~ 85°c (tj) operating temperature range. Moreover, the product comes in 676-bga. It include a total of 442368 RAM bits. The product contains 17280 logic cells/elements. In addition, it is reach unaffected. It is shipped in tray package . Its typical moisture sensitivity level is 3 (168 hours). It has a long 20 weeks standard lead time. It consists of 1920 CLBs/LABs. The product is available in surface mount configuration. It contains 1000000 gates. The product spartan®-3, is a highly preferred choice for users. 676-fbga (27x27) is the supplier device package value. It has optimum voltage supply of 1.14v ~ 1.26v. Moreover, it corresponds to xc3s1000, a base product number of the product. The product is designated with the 3a991d code number.

XC3S1000(L) FPGA Errata(Errata)

Xilinx REACH211 Cert(Environmental Information)

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AMD Xilinx XC3S1000-4FGG676C

XC3S1000-4FGG676C

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